Plasmaterials Logo Home Company Info Company Info INT Sales FAQ Contact Us
Plasmaterials - Plasma Technology for the Thin Film Industry, including sputtering targets, crucible liners & evaporation materials.
small to large area indium bonding for sputtering targets

Plasmaterials, Inc. provides all metal bonding to affix sputtering targets to backing plates for systems which do not utilize a bolt-on target assembly. These targets can range from elemental metals to oxides, nitrides, carbides, fluorides, compounds, refractories, ceramics, intermetallics, etc., including any combination thereof. Backing plates are typically produced from OFE copper, non-magnetic statinless steel (316 or 304), moylybdenum or aluminum. The purpose of the bonding is to provide the following functions during plasma deposition:

  • Mechanical Strength
  • Electrical Conductivity
  • Thermal Conductivity

This proprietary process utilizes a series of thin metallic layers to provide adhesion, diffusion barrier and wetting layers to the target and backing plates. These elemental materials are highly conductive, low vapor pressure materials which are coated on an atomic level. Each layer is specifically design, engineered an applied utilizing state-of-the-art technologies in order to guarantee the quality of each process step, as well as absolute reproducibility from target-to-target.

After the application of this thin film composite, a specially designed solder is used to bond the target to the backing plate. Plasmaterials utilizes different materials for each target/backing plate combination. Dending on the target characterization and backing plate material, a specific solder is chosen to optimize the bond. Particular attention is paid to the difference between the thermal coefficient of expansion of the target and the backing plate in conjunction with the ductility of the target.

During sputtering, the target surface is bombarded with high energy icons. The momentum transfer which results from the collision causes the individual atomic bonds on the target surface to be broken. In turn, the exothermic reaction results in a tremendous heat buildup on the target surface which must be dissipated. Typically, this is accomplished through direct water cooling of the backing plate configured within the cathode assembly. By metallically bonding the target directly to the backing plate, a direct link is provided to dissipate the heat from the target surface to the water cooling.

quote_request

Copyright Plasmaterials, Inc. Site Map Terms of Service Privacy Policy