Sintering of Ceramic Sputtering Targets

A while back (January 2016) we discussed a brief but fundamental description of what the basic processes are associated with the production of elemental and metal alloy sputtering targets. At that time we promised to address the analogous process of how ceramic, or...

Metallic Bonding

There are many reasons for bonding a sputtering target to an associated backing plate. In essence, all of these reasons basically relate to the physical properties associated with the composition of the sputtering target under consideration and the choice of the...

Alloy Development via. Simultaneous Deposition

Back in July I talked a bit about the sputtering of metallic alloys, or composite materials, and the relationship between the starting material compositions and that of the resultant films. Here I would like to do a follow up piece and discuss an alternative method of...

Sputtering of Alloys

Thin film alloys or composites of various compositions can be deposited via Physical Vapor Deposition (PVD) processing in a variety of different ways. Probably the most common practice is to simply sputter the alloy or composite material from a homogeneous alloy or...

Thin Film Solar Cells

This year has been busy so far visiting customers and attending a number of Trade Shows around the world and to my surprise, albeit based on a limited number of direct conversations with various technical personnel associated with a number of different companies, I...