Corrosion Resistant Thin Films

Many industrial applications for base materials require Thin Film Coatings that can help parts to sustain high temperatures, corrosive environments or both.  In a previous BLOG we covered the need for high temperature protective layers to safeguard base materials from...

Hard Coatings

Hard coatings, in one form or another, have been around for a long time.  The need to preserve or protect the surface of materials is not new.  From the prehistoric period of the Stone Age to the advent of metal working, man has been trying to keep implements with an...

Cathodic Arc Deposition

In the past, we have discussed numerous forms of Physical Vapor Deposition (PVD) technologies including Sputtering (r.f. and DC), Resistance Evaporation, Electron Beam Evaporation, and Pulsed Sputter Deposition. In this article I would like to review Cathodic Arc...

Ion Beam Deposition

Another form of Physical Vapor Deposition (PVD) is referred to as Ion Beam Deposition or Ion Beam Sputtering (IBS). Unlike conventional magnetron sputtering, where ions are generated in plasma within a cathode assembly, Ion Beam Sputtering employs a target that is...

Electron Beam Deposition Physical Vapor Deposition

In the last BLOG article I described the simplest form of resistance evaporation. That involved heating a resistance filament in a vacuum environment which in turn heats an evaporant material that is either melted or sublimated. The vapor created in the process is...

Thermal Evaporation

Over the past few years we have provided a series of BLOG articles discussing various aspects of Physical Vapor Deposition (PVD) as they relate specifically to Sputter Deposition. However, sputtering is only one subset of PVD processing. There are many other forms of...

Sintering of Ceramic Sputtering Targets

A while back (January 2016) we discussed a brief but fundamental description of what the basic processes are associated with the production of elemental and metal alloy sputtering targets. At that time we promised to address the analogous process of how ceramic, or...

Metallic Bonding

There are many reasons for bonding a sputtering target to an associated backing plate. In essence, all of these reasons basically relate to the physical properties associated with the composition of the sputtering target under consideration and the choice of the...