Aluminum Sputtering Target
ALUMINUM SPUTTERING TARGETS
Atomic Number: 13
Density: 2.70 g/cm3
Melting Point: 660 °C
Plasmaterials, Inc. provides high purity aluminum and aluminum alloys for all PVD applications. Sputtering targets are produced to fit all commercially available cathode configurations as well as for custom and customer specified designs.
Aluminum sputtering targets may either be supplied in monolithic form or metallically bonded to backing plates as required. Evaporation materials are supplied in pellet form by unit weight. Typical pellet sizes are either 1/8” or 1/4” in dia. by 1/8” to 1/4” in length. They can also be made to specific customer specifications. Electron beam starter sources are available in various sizes to fit directly into the E-beam hearth or to fit within a hearth liner.
You can sputter these elementally or reactively with a partial pressure of oxygen introduced in the working gas to produce aluminum oxide thin films. Resultant films are used in a variety of applications including telescopes, automotive headlamps, and mirrors. It is widely used in the aerospace, automotive lighting, OLED, and optical industries.