Titanium Sputtering Targets
TITANIUM SPUTTERING TARGET
Atomic Number: 22
Density: 4.506 g/cm3
Melting Point: 1668 °C
Plasmaterials, Inc. provides high purity titanium and titanium alloys for all PVD applications. Sputtering targets are produced to fit all commercially available cathode configurations as well as for custom and customer specified designs.
They can be supplied in monolithic form or metallically bonded to backing plates as required. Evaporation materials are supplied in pellet form by unit weight. Typical pellet sizes are either 1/8” or 1/4” in dia. by 1/8” to 1/4” in length. They can also be made to specific customer specifications as well. Electron beam starter sources are available in various sizes to fit directly into the E-beam hearth or to fit within a hearth liner.
Titanium sputtering targets can be sputtered elementally or reactively with a partial pressure of oxygen or nitrogen introduced in the working gas to produce titanium oxide or titanium nitride thin films. Resultant films are used in a variety of applications including surgical tools and implants. Titanium is generally evaporated in vacuum for the purposes of wear and decorative, semiconductor, and optical coatings.